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1 hlmp-egxx, hlmp-ehxx, hlmp-elxx new t-1? (5mm) extra high brightness alingap led lamps data sheet features viewing angle: 15, 23, 30 high luminous output colors: 590nm amber 615nm red orange 626nm red package options: with or without lead stando? superior resistance to moisture untinted for 15, 23 and 30 lamps applications tra?c management: - tra?c signals - pedestrian signals - work zone warning lights - variable message signs solar power signs commercial outdoor advertising - signs - marquees description these precision optical performance alingap leds provide superior light output for excellent readability in sunlight and are extremely reliable. alingap led tech- nology provides extremely stable light output over long periods of time. precision optical performance lamps utilize the aluminum indium gallium phosphide (alingap) technology. these led lamps are untinted, t-1? packages incorpo- rating second generation optics producing well de?ned spatial radiation patterns at speci?c viewing cone angles. these lamps are made with an advanced optical grade epoxy o?ering superior high temperature and high moisture resistance performance in outdoor signal and sign application. the maximum led junction tempera- ture limit of +130c enables high temperature operation in bright sunlight conditions. the epoxy contains both uv-a and uv-b inhibitors to reduce the e?ects of long term exposure to direct sunlight. bene?ts superior performance for outdoor environments suitable for auto-insertion onto pc board
2 package dimension a: non-stando? b: stando? viewing angle d 15 12.390.25 (0.4760.010) 23 & 30 11.960.25 (0.4590.010) notes: 1. all dimensions are in millimeters (inches) 2. leads are mild steel with tin plating. 3. the epoxy meniscus is 1.21mm max 4. for identi?cation of polarity after the leads are trimmed o?, please refer to the illustration below: c a thod e a nod e 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 31.60 (1.244) m in. 0.70 (0.028) ma x. 1.00 (0.039) m in. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. ty p . c a thod e lea d 2.35 (0.093) ma x. c a thod e f la t 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 31.60 (1.244) m in. 0.70 (0.028) ma x. 1.00 (0.039) m in. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. ty p . c a thod e lea d c a thod e f la t d 1.50 0.15 (0.059 0.006) 5.00 0.20 (0.197 0.008) 5.00 0.20 (0.197 0.008)
3 part numbering system note: please refer to ab 5337 for complete information on part numbering system. d evice s election guide typical viewing angle 2 1/ 2 (d eg ) [ 4 ] c olor and d ominant wavelength ( nm ) , typ [ 3 ] lamps without s tando? on leads ( package drawing a ) lamps with s tando? on leads ( package drawing b ) luminous intensity iv ( mcd ) [1, 2 , 5 ] at 20 ma min max 15 amber 590 hlmp-el1a-z1kdd hlmp-el1b-z1kdd 12000 21000 hlmp-el1a-z1ldd hlmp-el1b-z1ldd 12000 21000 red 626 hlmp-eg1a-z10dd HLMP-EG1B-Z10DD 12000 21000 red orange 615 hlmp-eh1a-z10dd hlmp-eh1b-z10dd 12000 21000 23 amber 590 hlmp-el2a-xykdd hlmp-el2b-xykdd 7200 12000 hlmp-el2a-xyldd hlmp-el2b-xyldd 7200 12000 red 626 hlmp-eg2a-xy0dd hlmp-eg2b-xy0dd 7200 12000 red orange 615 hlmp-eh2a-xy0dd hlmp-eh2b-xy0dd 7200 12000 30 amber 590 hlmp-el3a-vwkdd hlmp-el3b-vwkdd 4200 7200 hlmp-el3a-vwldd hlmp-el3b-vwldd 4200 7200 hlmp-el3a-wxkdd hlmp-el3b-wxkdd 5500 9300 hlmp-el3a-wxldd hlmp-el3b-wxldd 5500 9300 red 626 hlmp-eg3a-vw0dd hlmp-eg3b-vw0dd 4200 7200 hlmp-eg3a-wx0dd hlmp-eg3b-wx0dd 5500 9300 red orange 615 hlmp-eh3a-wx0dd hlmp-eh3b-wx0dd 5500 9300 notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. the optical axis is closely aligned with the package mechanical axis. 3. dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the lamp. 4. ? is the o?-axis angle where the luminous intensity is half the on-axis intensity. 5. tolerance for each bin limit is 15% h lmp C e x xx - x x x xx mechanica l o p t ions dd : ammo pack c o l or bin s e l ec t ions 0 : fu ll co l or distribution k : co l or bin 2 & 4 l : co l or bin 4 & 6 maximum i n t ensi t y bin refer to device se l ection guide minimum i n t ensi t y bin viewing ang l e and lead st ando ff s 1 a: 1 5 without l ead standoff 1 b: 1 5 with l ead standoff 2a: 23 without l ead standoff 2b: 23 with l ead standoff 3a: 30 without l ead standoff 3b: 30 with l ead standoff c o l or g : red 626nm l : amber 590nm h: red orange 6 1 5nm refer to device se l ection guide
4 electrical / o ptical c haracteristics t j = 25c parameter s ymbol min typ . max units test c onditions forward voltage amber/ red / red orange v f 1.8 2.1 2.4 v i f = 20 ma reverse voltage v r 5vi r = 100 a dominant wavelength [1] amber red red orange d 584.5 618.0 612.0 590.0 626.0 615.0 594.5 630.0 619.0 nm i f = 20 ma peak wavelength amber red red orange peak 594 634 621 nm peak of wavelength of spectral distribution at i f = 20 ma spectral halfwidth amber red red orange 1/2 13 14 14 nm thermal resistance r j-pin 240 c/w led junction to anode lead luminous e?cacy [2] amber red red orange v 500 200 265 lm/w emitted luminous flux/ emitted radiant flux luminous flux amber red red orange v 2100 2300 2300 mlm i f = 20 ma luminous e?ciency [3] amber red red orange e 50 55 55 lm/w emitted luminous flux/electrical power thermal coe?cient of d amber red red orange 0.08 0.05 0.07 nm/c i f = 20 ma ; +25c t j +100c notes: 1. the dominant wavelength, d is derived from the cie chromaticity diagram referenced to illuminant e. tolerance for each color of dominant wavelength is +/- 0.5nm. 2. the radiant intensity, i e in watts per steradian, maybe found from the equation i e = i v / v where iv is the luminous intensity in candela and v is the luminous e?cacy in lumens/ watt. 3. e = v /i f x v f where v is the emitted luminous ?ux, i f is electrical forward current and v f is the forward voltage. absolute maximum ratings t j = 25c parameter red/ amber/ red o range unit dc forward current [2] 50 ma peak forward current 100 [1] ma average forward current 30 ma power dissipation 120 mw reverse voltage 5 v operating temperature range -40 to +100 c storage temperature range -40 to +100 c notes: 1. duty factor 30%, frequency 1khz. 2. derate linearly as shown in figure 4
5 figure 1 . relative intensity vs peak wavelength figure 2. forward c urrent vs forward voltage figure 3. relative luminous intensity vs forward c urrent figure 4. maximum forward c urrent vs ambient temperature figure 5. radiation pattern f or 1 5 viewing angle lamp figure 6. radiation pattern f or 23 viewing angle lamp 0 20 40 60 80 100 0123 fo rwar d v o l t age - v fo rwar d c urre nt- ma 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 20406080100 dc fo rwar d c urre nt - ma rela ti ve lum ino u s int e nsity (no rmal iz e d a t 20 ma ) 0 10 20 30 40 50 60 0 20 40 60 80 100 t a - amb i e nt t empera t ure - - c i f ma x - ma xi mum fo rwar d c urre nt - ma 0.0 0.2 0.4 0.6 0.8 1.0 -90 -60 -30 0 30 60 90 a n gular dis pla c eme nt-d egree no rmal iz e d int e nsity 0.0 0.2 0.4 0.6 0.8 1.0 -90 -60 -30 0 30 60 90 a n gular dis pla c eme nt-d egree no rmal iz e d int e nsity 0.0 0.2 0.4 0.6 0.8 1.0 500 550 600 650 wavele n g th - nm rela ti ve int e nsity red amber red o range
6 0.0 0.2 0.4 0.6 0.8 1.0 -90 -60 -30 0 30 60 90 a n gular dis pla c eme nt-d egree no rmal iz e d int e nsity figure 7. radiation pattern f or 30 viewing angle lamp relative forward voltage vs junction temperature relative light output vs junction temperature 0.1 1.0 10.0 -40 -20 0 20 40 60 80 100 120 140 t j - j u nction t empera t ure - c rela ti ve l i g ht o u t pu t (no rmal iz e d a t tj=25 c) -0.30 -0.25 -0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 0.20 -40 -20 0 20 40 60 80 100 120 140 t j - j u nction t empera t ure - c fo rwar d v o l t age shift - v red o range red amber red o range red amber
7 intensity bin limit table ( 1 .3 :1 iv bin ratio ) bin intensity ( mcd ) at 20 ma min max v 4200 5500 w 5500 7200 x 7200 9300 y 9300 12000 z 12000 16000 1 16000 21000 tolerance for each bin limit is 15% vf bin table ( v at 20 ma ) bin i d min max vd 1.8 2.0 va 2.0 2.2 vb 2.2 2.4 tolerance for each bin limit is 0.05v avago color bin on cie 1931 chromaticity diagram 0.280 0.300 0.320 0.340 0.360 0.380 0.400 0.420 0.440 0.460 0.500 0.550 0.600 0.650 0.700 0.750 0.800 x y 2 4 6 amber red red o range red c olor range min d om max d om x min y min x max y max 618 630 0.6872 0.3126 0.6890 0.2943 0.6690 0.3149 0.7080 0.2920 tolerance for each bin limit is 0.5nm amber c olor range bin min d om max d om x min y min x max y max 2 587 589.5 0.5570 0.4420 0.5670 0.4250 0.5530 0.4400 0.5720 0.4270 4 589.5 592 0.5720 0.4270 0.5820 0.4110 0.5670 0.4250 0.5870 0.4130 6 592 594.5 0.5870 0.4130 0.5950 0.3980 0.5820 0.4110 0.6000 0.3990 tolerance for each bin limit is 0.5nm red o range c olor range min d om max d om x min y min x max y max 612 619 0.6712 0.6887 0.6716 0.6549 0.3280 0.3109 0.3116 0.3282 tolerance for each bin limit 0.5nm note: all bin categories are established for classi?cation of products. products may not be available in all bin categories. please contact avago representative for further information.
8 precautions: lead forming: the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: care must be taken during pcb assembly and soldering process to prevent damage to the led component. led component may be e?ectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. 1.59 mm esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. recommended soldering condition: wave s oldering [1, 2 ] manual s older d ipping pre-heat temperature 105 c max. - preheat time 60 sec max - peak temperature 260 c max. 260 c max. dwell time 5 sec max. 5 sec max note: 1) above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2) it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering pro?le to ensure that it is always conforming to recommended soldering conditions. anode note: 1. pcb with di?erent size and design (component density) will have di?erent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering pro?le again before loading a new type of pcb. 2. avago technologies high brightness led are using high e?ciency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260c and the solder contact time does not exceeding 5sec. over-stressing the led during soldering process might cause premature failure to the led due to delamination. avago technologies led con?guration note: electrical connection between bottom surface of led die and the lead frame is achieved through conductive paste. any alignment ?xture that is being applied during wave soldering should be loosely ?tted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. note: in order to further assist customer in designing jig accurately that ?t avago technologies product, 3d model of the product is available upon request. at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment ?xture or pallet. if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using re?ow soldering prior to insertion the th led. recommended pc board plated through holes (pth) size for led component leads. le d component lead size d iagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause di?culty inserting the th led.
9 refer to application note an5334 for more information about soldering and handling of high brightness th led lamps. example of wave soldering temperature pro?le for th led ammo packs drawing note: the ammo-packs drawing is applicable for packaging option Cdd & -zz and regardless stando? or non-stando? recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin flux solder bath temperature: 255 c 5 c (maximum peak temperature = 260 c) dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) note: allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 60 sec max ti me ( sec ) 260 c max 105 c max t empera t ure ( c)
10 packaging box for ammo packs note: the dimension for ammo pack is applicable for the device with stando? and without stando?. packaging label: (i) avago mother label: (available on packaging box of ammo pack and shipping box)

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disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. ')4
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(ii) avago baby label (only available on bulk packaging) acronyms and de?nition: bin: (i) color bin only or vf bin only (applicable for part number with color bins but without vf bin or part number with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part number that have both color bin and vf bin) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin bin: 2vb vb: vf bin vb 2: color bin 2 only for product information and a complete list of distributors, please go to our web site: www . avagotech . com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2010 avago technologies. all rights reserved. av02-1687en - february 23, 2010

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